3D KOH YOUNG SPI Machine KY8030 SMT SPI Machine

The KY8030 SPI machine is a specialized equipment used in the electronics manufacturing industry for solder paste inspection (SPI) during the surface mount technology (SMT) assembly process. It offers advanced features and capabilities that ensure accurate and efficient inspection of solder paste deposits on printed circuit boards (PCBs) before component placement.

• Full 3D measurement and inspection solutions
• Solve shadow issues by using bidirectional projection
• Full 3D foreign object detection solution, applicable to the entire PCB
• Provides accurate inspection data with real-time PCB deformation compensation
• Process optimization solution based on full 3D data: realizing Industry 4.0/Smart Factory
• Real-time process optimization through powerful SPC analysis
• Provides powerful printing process optimization tools
• A leading model suitable for high-speed high-volume production lines

1. High-Resolution Imaging: The KY8030 SPI machine utilizes high-resolution imaging technology to capture detailed images of the solder paste deposits on the PCB. This imaging capability enables precise inspection and measurement of paste volume, shape, and alignment.
2. 3D Inspection: The machine is equipped with a 3D inspection system that utilizes laser or structured light projection to create a detailed three-dimensional representation of the solder paste deposits. This allows for accurate height measurement and detection of defects such as insufficient or excessive solder paste.
3. Automatic Inspection: The KY8030 SPI machine automatically scans and inspects the solder paste deposits on the PCBs. It compares the inspected data against predefined specifications and identifies any deviations or defects in real-time.
4. Inspection Data Analysis: The machine provides comprehensive data analysis capabilities, including statistical analysis and data visualization. It allows operators to analyze trends, identify process variations, and make informed decisions for process optimization and quality improvement.
5. Intuitive User Interface: The machine is equipped with a user-friendly interface that allows operators to set up inspection parameters, define inspection regions, and visualize inspection results. The interface provides easy-to-understand graphical representations for quick interpretation of inspection data.

1. Setup: Ensure that the KY8030 SPI machine is properly installed and connected to the power supply. Calibrate the machine according to the manufacturer's instructions to ensure accurate measurement and inspection.
2. PCB Preparation: Prepare the PCBs for inspection by ensuring that the solder paste is applied accurately and in the appropriate locations. Verify that the PCBs are clean and free from any contaminants that may affect the inspection.
3. Programming: Use the machine's interface to set up the inspection parameters, such as inspection region, threshold values, and defect detection criteria. Define the inspection requirements based on the solder paste specifications and assembly process guidelines.
4. Loading: Place the PCBs onto the inspection stage or conveyor system of the KY8030 SPI machine. Ensure proper alignment and fixation to prevent any movement or misalignment during the inspection process.
5. Inspection: Initiate the inspection process using the machine's interface. The machine will automatically scan the solder paste deposits on the PCBs, capturing images and collecting inspection data. Monitor the inspection results in real-time and identify any defects or deviations from the predefined specifications.
6. Data Analysis: Analyze the inspection data using the machine's data analysis tools. Utilize statistical analysis, visualization, and trend monitoring to identify process variations and take appropriate corrective actions if necessary.
7. Reporting: Generate inspection reports that summarize the inspection results, including defect analysis, statistical data, and visual representations. These reports can be used for process improvement and documentation purposes.
8. Maintenance: Regularly clean the machine's imaging system and inspection stage to ensure accurate and reliable performance. Follow the manufacturer's maintenance guidelines for any required calibration or component replacement.

The KY8030 SPI machine offers advanced capabilities for accurate solder paste inspection in electronic manufacturing. By following the proper setup and usage instructions, it enables efficient process control and quality assurance in the SMT assembly process.

1. If machine have any problem after I receive it, how can I do ?
2. Free parts send to you in machine warranty period.
3. MOQ ?
4. 1 set machine, mixed order is also welcomed.
5. How can I buy this machine from you? ( Very easy and flexible !)
6. A. Consult us about this product on line or by e-mail.
7. B. Negotiate and confirm the final price , shipping , payment methods and other terms.
8. C. Send you the proforma invoice and confirm your order.
9. D. Make the payment according to the method put on proforma invoice.
10. E. We prepare for your order in terms of the proforma invoice after confirming your full payment.
11. And 100% quality check before shipping.
12. F. Send your order by air or by sea.